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Wafer grinding

  • Time of issue:2023-01-13

Wafer grinding

(Summary description)

  • Time of issue:2023-01-13
Information

For wafer thinning or cutting ,with high durability and high efficiency.

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Address

Room 506, 5th Floor, Diwang Center Office Building, Changqing Road, Chang'an Town, Dongguan City, Guangdong Province

玉宝钻石

Contact us

Web:www.yubodia.com
QQ:2079442272
Skype:yubodia04
Alibaba Store:
https://yubodia.1688.com/
Jiangxi Address:Diamond Tools Industrial Park, Tianfan Street, Poyang County, Jiangxi Province

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